2018全球云计算大会中国站 | Cloud Connect China
 
May 9-11, 2018 Shanghai Int'l Convention Center     
 
 
Cloud 2018

Cloud Connect China 2018 – Tour in Two Cities

As new technologies like cloud computing, big data, AI and so forth are promoting enterprises’construction of informatization, Cloud Connect China, one of the most influential events in cloud computing industry in China, will be upgraded in 2018 after the successful conclusion of the 5th edition in 2017 with the debut of Interop - one of the max events in global networking market for more than 30 years.

To enhance the participation of end-user enterprises and to optimize the cloud strategy and practices in a thorough way, Interop & Cloud Connect China 2018 will be held twice a year in two cities for the first time with one in May in Shanghai and the other in September in Zhengzhou, still in the form of conferences and an expo.

Five Years’ Success with High Reputation
Cloud Connect China was introduced into Chinese market by UBM China since 2013 in the form of conferences and an expo and supervised by Shanghai Municipal Commission of Economy and Informatization. It was projected to be a great comprehensive communication platform gathering together cloud suppliers, developers and end users. About ten internationally well-known cloud computing enterprises exhibited and thousands of professional audience assembled. Information were shared about the applications of cloud computing in popular fields and the latest development trend.

In 2017, Interop & Cloud Connect China was successfully held on September 5-7 at Shanghai World Expo Exhibition & Convention Center, which had hundreds of enterprises of cloud computing, cybersecurity, networking, etc and C-level leaders of IT department from end-user industries. 3257 people were present and 63 IT professionals delivered speeches on technological topics. And most participants spoke highly of the simultaneous activities such as “The 4th Top Cloud Connect Awards Ceremony”, “Enterprise CIO Forum”, “Matchmaking Event”, etc.

May in Shanghai and September in Zhengzhou
Interop & Cloud Connect China 2018 is set to focus on industry application and matchmaking with the linkage of partners in both southern and northern China. Domestic and overseas IT leaders will come together and share deep interpretations with end users on the technology needs of Internet and the difficulties accompanying. Many key technological topics will be discussed throughout the event like cloud computing, big data, Internet of Things, cybersecurity and AI, etc.

It’ll be a new beginning that Interop & Cloud Connect China 2018 is to be held in Shanghai International Convention Center on May 9-11. There will be many simultaneous forums on industry application through the event to cater for audience from end-user industries such as finance, medicine, education, etc, which are aimed at realizing the productive matchmaking between upstream and downstream enterprises by putting emphases on the needs of industry informatization and providing practice studies of good solutions and diversified application topics and demonstrations of cloud computing technologies and products.

On the other hand, based on the characteristics of industries in Henan province and with the strong support of provincial government, Interop & Cloud Connect China will take place in Zhengzhou International Convention Center for the first time on September 27-29.

Zhengzhou, an important central city in Chinese middle-area, is far ahead of other Chinese cities in multimodel transport, cross-border E-commerce, storage and distribution. In 2018, In order to bring benefits to multimodal transport and cross-border E-companies in Zhengzhou, topics during Interop & Cloud Connect China 2018 to be discussed will include construction of big data centers in Zhengzhou and the development of logistics intelligentize and the whole flow solutions and application cases will be demonstrated.

One-stop Service – Bridge between Upstream and Downstream
Interop & Cloud Connect China 2018 will be an incomparable one-stop platform for IT suppliers to demonstrate their brands and images through showcasing products and technologies at the booth or delivering speeches at the workshop , keynote or other tracks and so forth, which will also be an accelerator of companies’enlargement of their influence on target markets. Now, opportunities of showing up at Interop & Cloud Connect China 2018 are open to IT suppliers specializing in cloud computing, big data, networking, etc. Apply for getting a booth or sponsorship now and enjoy early bird treatment.

In the meantime, the advisory board of Interop & Cloud Connect China 2018 is accepting speech proposals for the Shanghai event held on May 9-11. All experts in cloud computing industry or related downstream industries are welcomed to submit proposals before January 19 and grab the chance of being one of the international speakers to share insights about technology revolution, trends and application cases with thousands of attendees.

Click here to learn more details about “Call for Submission”:
http://www.cloudconnectevent.cn/en-us/Call-for-Submission
More information about Interop & Cloud Connect China 2018:
http://www.cloudconnectevent.cn/en-us/index
Learn all forms of booths or sponsorship:
http://www.cloudconnectevent.cn/en-us/Sponsorship-Opportunities

About Interop & Cloud Connect
Organized by UBM Tech, Cloud Connect was firstly held in U.S Silicon Valley and crowned as one of the Top 10 Global Cloud Computing Events. Interop, one of the max events in global networking market, has been successfully held by UBM for consecutive 30 years. It is held twice a year in Las Vegas and Tokyo, being focused on specialized technology fields such as datacentre, cloud storage service, high-speed network data exchange, wireless and mobile, virtual information service, data unified communication, information security, venture management, business application of high-speed network, etc.

Contact sales for customized exhibiting plan:
Ms. Kico Wang
(86-21)6157 7241
kico.wang@ubm.com

Mr. Alex Sun
(86-21)6157 3948
alex.sun@ubm.com

Mr. Derren Gong
(86-21)6157 7250
derren.gong@ubm.com